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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask

Shenzhen Xinchenger Electronic Co.,Ltd
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60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : Rogers

Layer : 2

Color : White

Min line space : 5mil

Min line width : 5mil

Copper thickness : 1OZ

Board size : 65*165mm

Panel : 1

Surface : Immersion Gold

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60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure

Key Specifications/Special Features:
PCB features:
Layer: 2
Material: Rogers
Thickness: 1.524mm
Copper: 1oz
Mini hole: 0.2mm
Mini width/space: 0.2mm/0.2mm
Finish: immersion Gold

Specifiction:
layer:2
board thickness:1.524mm
Copper thickness:1oz
min Hole size:0.2mm
min line width and distance:10/10mil
Surface treatment: imersion gold
Application: 60GHz Development System

Product Description
L1-L2 Blind holes;
L2-L3 Bury holes;
L1-L4 Through holes;
Copper based with Rogers 4003 T1.3mm.
Copper thickness 0.70mm;
Milling thickness 1.2mm.

Specification

PCB Type: Rogers PCB
Layer : 2 layer
Min .Line Width/Space: 3mil/3mil
Min. Via Diameter: 0.3mm
Finish Thickness: 0.2mm
Surface Finish: ENIG
Size: 65*165MM
Material: Rogers
Color: White
Application: aviation

60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure

Available substrates:
RO4350B RO4003C TLX-8 (TACONIC) F4B Woven Glass-Reinforced PTFE
4mil(0.1mm) 8mil (0.203mm) 20mil(0.5mm)
10mil(0.254mm) 12mil(0.3mm) 30mil(0.762mm)
13.3mil(0.338mm) 20mil(0.508mm) 40mil(1.0mm)
20mil (0.508mm) 32mil(0.813mm)
30mil(0.762mm) 60mil(1.524mm)
60mil(1.524mm)

Specification:

High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.

Why us:
1 Iso 9001,14001,TS16949,UL Certified.
2 900+staff,registered capital USD1.68million.
3 Full-process workshop-lamination workshop,imersion gold workshop,AOI test

4 Mental base PCB,high frequency pcb(rogers,ITEQ,tyflon,Taconic),Buried/blind via board,1~20layers board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available here.
6 All exported PCB have double-check before sending out.

UL (E246887), ISO9001, TS16949, ISO 14001 certified.

Turnover USD 50-100 million per year

25,000 sqm area,900+ staff

Mass Production from single to 20 layers

Special Material: ROGERS, Arlon, Taconic.etc.

Client: SAMSUNG, Skyworth, Malata, Midea.etc.

Description :
RO3003™ high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.



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